
Job Description
Job Requirements
• The responsibilities will include several of the following, but not be limited to:
• Performing floor-planning and routing studies and implementation at block and full-chip level
• Push down the top-level floorplan and clock to Partition.
• IO Planning and bump planning
• Closely working with Package team and reaching Die file milestones
• Full chip and partition level timing analysis.
• Evaluate low power techniques and power reduction opportunities
• Perform clock distribution design and analysis
• Perform Physical verification activities at full-chip level.
• Drive technical activities of physical design during technology readiness, design & execution
• In-depth knowledge and hands-on experience on Netlist2GDSII Implementation i.e. Floorplanning, Power Grid Design, Placement, CTS, Routing, STA, Power Integrity Analysis, Physical Verification, Chip finishing. Should have experience in Physical Design Methodologies and sub-micron technology of 16nm and lower technology nodes
Work Experience
• Experience Range:- 4Yrs - 10 Yrs
Should be able to handle PD task independently and also should be able to manage the small team
• Should have experience in handling >1M instance count, 1 GHz frequency designs
• Should have experience in programming in Tcl/Tk/Perl to automate the design process and improve efficiency
• Must have hands-on experience on PNR Suite from Cadence & Synopsys (Innovus & ICC2)
• Strong experience in Static Timing Analysis (PrimeTime – SI), EM/IR-Drop analysis (PT-PX, Redhawk), Physical Verification (Calibre).
Industries: Computer Software, Mechanical Or Industrial Engineering, Telecommunications
Job Skills
- STA
- Chip
- Design
Job Overview
Date Posted
Location
Offered Salary
Not disclosed
Expiration date
Experience
